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Entegris, Inc. Stock Price History

Entegris, Inc. EPS

EPSDividend / share
-0.80.21.32.33.3200920112013201520172019202120232025

Entegris, Inc. Dividend per Share

Forward Yield
0.28%
Annual Dividend
0.40 USD
Payout
23.12%
Frequency
Quarterly
Yrs of growth
CAGR 5Y
4.56%
0.00.10.20.30.4201720182019202020212022202320242025

Entegris, Inc. Dividend Yield

Entegris, Inc. Payout Ratio

0%9%18%27%36%201720182019202020212022202320242025

Entegris, Inc. Dividend Growth

1Y CAGR
3Y CAGR
5Y CAGR
10Y CAGR
20Y CAGR
0.00%
0.00%
4.56%
Compound annual growth rate of dividend per share
Yield vs sector
0.28%
avg Technology: 2.76%
Next ex-dividend (est.)
2026-07-29
last: 2026-04-29
Ex-DateAmount
2026-04-290.10 USD
2026-01-280.10 USD
2025-10-290.10 USD
2025-07-300.10 USD
2025-04-300.10 USD
2025-01-290.10 USD
2024-10-300.10 USD
2024-07-310.10 USD

Entegris, Inc. is a materials science company that provides advanced materials and process solutions primarily to the global semiconductor and broader microelectronics industries. The company focuses on enabling high-performance, high-purity manufacturing environments through products that support critical steps in chip fabrication and related high-tech processes. Entegris operates through business segments that encompass specialty chemicals, filtration and purification technologies, and advanced materials handling solutions, addressing contamination control, yield enhancement, and process efficiency needs across the semiconductor supply chain. Its offerings are used by semiconductor manufacturers, equipment makers, and other high-tech customers that require stringent purity and reliability standards. Headquartered in Billerica, Massachusetts and founded in 1966, Entegris serves customers worldwide through a network of manufacturing, research, and customer service facilities in key technology hubs across North America, Europe, and Asia. The company plays a significant role in supporting leading-edge semiconductor nodes, contributing to the performance and reliability of devices used in computing, communications, automotive, and industrial applications.